Molybdenum Copper Heat Sink
Molybdenum copper heat sink is a cooling device made from a composite material of molybdenum (Mo) and copper (Cu), typically used in high-power electronic devices such as power semiconductor devices, microprocessors, or lasers. The molybdenum-copper alloy combines molybdenum's high melting point, corrosion resistance, and low thermal expansion coefficient with copper's excellent thermal conductivity and electrical conductivity, giving it unique advantages in thermal management.
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Features:
High Thermal Conductivity: Copper has a high thermal conductivity (around 400 W/m·K), allowing the molybdenum-copper alloy heat sink to quickly transfer heat away from the heat source.
Controllable Thermal Expansion Coefficient: Molybdenum has a low thermal expansion coefficient (around 5.1×10??/K). By adjusting the ratio of molybdenum and copper, the alloy's thermal expansion coefficient can be matched with semiconductor materials (such as silicon or gallium arsenide), reducing thermal stress.
Mechanical Strength: Molybdenum imparts high hardness and wear resistance to the alloy, making it suitable for use in harsh environments.
High Temperature Resistance: The high melting point of molybdenum (around 2623°C) ensures that the heat sink remains stable under high-temperature conditions.
Applications:
Electronics Industry: Used for cooling IGBT modules, RF power amplifiers, LED chips, etc.
Aerospace: Applied in thermal management scenarios requiring lightweight and high reliability.
Laser Equipment: Used as substrates or cooling components for laser diodes.
Manufacturing:
Molybdenum-copper alloys are typically produced using powder metallurgy. Molybdenum powder and copper powder are mixed, then pressed into shape and sintered at high temperatures. Common molybdenum-copper ratios include Mo70Cu30, Mo60Cu40, etc., with the specific ratio depending on the desired thermal conductivity and thermal expansion properties.
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